NIST Time|NIST Home|About NIST|Contact NIST

HomeAll Years:AuthorKeywordTitle2005-2010:AuthorKeywordTitle

Numerical Simulation of Multi-Droplet Evaporative Cooling.

pdf icon Numerical Simulation of Multi-Droplet Evaporative Cooling. (619 K)
Tartarini, P.; Liao, Y.; diMarzo, M.

ATTI. National Congress on Heat Transfer, 10th. Universita degli Studi di Genova, Italy. March 25-27, 1992, Genova, Italy, 123-132 pp, 1992.

Heat and Technology, Vol. 11, No. 1/2, 98-107, 1993.


National Institute of Standards and Technology, Gaithersburg, MD


droplets; evaporation cooling; numerical analysis; formulations; thermal conductivity; solid surfaces


A theoretical study is carried out to predict the thermal behavior of a solid surface subjected to multi-droplet evaporative cooling. A single-droplet numerical code, which has been previously presented and validated, is used here to gain insight into the behavior of a surface subjected to dropwise evaporative cooling. On the basis of the single-droplet results, a generalized model is presented and a novel numerical code is formulated, which analyzes the effects of a multi-droplet evaporative transient on a low thermal conductivity solid surface. The main parameters that characterize the evaporative transient behavior are identified. Some numerical results obtained with this new model are presented and discussed.