Numerical Simulation of Multi-Droplet Evaporative Cooling.
Numerical Simulation of Multi-Droplet Evaporative
Tartarini, P.; Liao, Y.; diMarzo, M.
ATTI. National Congress on Heat Transfer, 10th.
Universita degli Studi di Genova, Italy. March 25-27,
1992, Genova, Italy, 123-132 pp, 1992.
Heat and Technology, Vol. 11, No. 1/2, 98-107, 1993.
Sponsor:National Institute of Standards and Technology,
droplets; evaporation cooling; numerical analysis;
formulations; thermal conductivity; solid surfaces
A theoretical study is carried out to predict the
thermal behavior of a solid surface subjected to
multi-droplet evaporative cooling. A single-droplet
numerical code, which has been previously presented and
validated, is used here to gain insight into the
behavior of a surface subjected to dropwise evaporative
cooling. On the basis of the single-droplet results, a
generalized model is presented and a novel numerical
code is formulated, which analyzes the effects of a
multi-droplet evaporative transient on a low thermal
conductivity solid surface. The main parameters that
characterize the evaporative transient behavior are
identified. Some numerical results obtained with this
new model are presented and discussed.