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Quantifying Water at the Organic Film/Hydroxylated Substrate Interface.


pdf icon Quantifying Water at the Organic Film/Hydroxylated Substrate Interface. (1676 K)
Nguyen, T.; Byrd, W. E.; Bentz, D. P.

Journal of Adhesion, Vol. 48, 169-194, 1995.

Keywords:

ATR; building technology; FT-IR; interface; internal reflection spectroscopy; in situ measurement; quantitative; water

Abstract:

A method, based on Fourier transform infrared-multiple internal reflection (FTIR-MIR) spectroscopy, for determining the amount and thickness of water at an organic film/hydroxylated substrate interface has been developed. The analysis uses a two-layered model, which takes into account: (1) water at the organic film/hydroxylated substrate interface, (2) water taken up by the organic film within the penetration depth of the evanescent wave and (3) change of the penetration depth as water displaces the organic film from the substrate. Experimentally, the method requires the application of an organic film, transparent or opaque, of sufficient thickness on a hydroxylated internal reflection element, which is used as the substrate. A water chamber is attached to the organic-coated specimen. After adding water to the chamber, FTIR-MIR spectra are taken automatically at specified time intervals without disturbing the specimen or the instrument. Water uptake in the organic films and FTIR-MIR spectra of water on the substrates are also obtained and used for the analysis. Results of examples of three organic films: a clear epoxy, and unmodified asphalt, and a pigmented ester, on a hydroxylated SiO2-Si substrate were presented to demonstrate the method. The water layer at the interface for the ester and asphalt specimens was found to be much thicker than that for the epoxy, and this was attributed to the presence of a water-sensitive layer accumulated at the interface for the formers. The method should be equally applicable to studies of organic and inorganic compounds at the organic film/hydroxylated substrate interface and their transport rates through films adhered to a substrate.